Thick Film Hybrids

Thick Film Solutions has the capability to design and manufacture low complexity thick film hybrids. In practice low complexity means that the circuit has no ASICs, memory or microprocessors. Thick Film Solutions does not provide hermetic military hybrids. If you need a complex or military hybrid, we would be glad to assist you on the substrate design and recommend a suitable manufacturer.

Thick Film Solutions hybrids are typically ceramic substrates with surface mount components and soldered on leads. We can provide die attach and wirebonding. The circuits can be protected with encapsulant over the die / wirebonds or conformally coated.